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Supermicro X11SPi-TF server/workstation motherboard ATX **

ATX, Intel Xeon Processor Scalable Family

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Web ID: W000096329
Mfr. Part: MBD-X11SPI-TF-O

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Intel Xeon Processor Scalable Family, Single Socket P (LGA 3647) supported, CPU TDP support 205W
Intel C622 chipset
Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
Expansion slots:
1 PCI-E 3.0 x16,
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
I/O: 1 VGA, 2 COM, TPM header
2 SuperDOM with built-in power
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
M.2 NGFF connector

** Unless defective, this product is final sale once the packaging has been opened.

Overview
BIOS
BIOS type:
UEFI AMI
ACPI version:
6.0
Expansion slots
PCI Express x8 (Gen 3.x) slots:
1
PCI Express x16 (Gen 3.x) slots:
1
PCI Express x4 (Gen 3.x) slots:
1
Storage controllers
RAID levels:
0,5,10
Features
Motherboard form factor:
ATX
Trusted Platform Module (TPM):
Yes
Internal I/O
USB 2.0 connectors:
6
Memory
Maximum internal memory:
1000 GB
Supported memory types:
DDR4-SDRAM
Supported memory clock speeds:
1600,1866,2133,2400,2666 MHz
Memory voltage:
1.2 V
ECC:
Yes
Number of DIMM slots:
8
Supported DIMM module capacities:
4GB, 8GB, 16GB, 32GB, 64GB, 128MB
Network
Ethernet LAN:
Yes
Ethernet interface type:
10 Gigabit Ethernet
Wi-Fi:
No
Operational conditions
Operating temperature (T-T):
0 - 50 C
Storage temperature (T-T):
-40 - 70 C
Operating relative humidity (H-H):
8 - 90%
Storage relative humidity (H-H):
5 - 95%
Processor
Thermal power:
205 W
Rear panel I/O ports
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
5
Processor
Processor manufacturer:
Intel
Rear panel I/O ports
USB 2.0 ports quantity:
6
VGA (D-Sub) ports quantity:
1
COM ports quantity:
2
Weight & dimensions
Width:
304.8 mm
Depth:
243.8 mm

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